| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, in conventional semiconductor devices, a structure and an arrangement place of an island is limited to prevent a preform material from flowing out from the island.SOLUTION: In a semiconductor device 1 of the present invention, two islands 9 and 10 spaced apart from each other are disposed in a resin package 2, and semiconductor chips 11 and 12 are fixed on top surfaces of the islands 9 and 10 via a preform material 20. Although the semiconductor chip 11 is disposed to the vicinity of the resin package 2, a groove 13 is formed in the island between the semiconductor chip 11 and a side surface 3. This configuration prevents the preform material 20 from flowing out from the island 9 while semiconductor chips 11 and 12 are efficiently disposed. |
