| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method which prevent contamination due to a process liquid adhering to a nozzle arm.SOLUTION: A nozzle arm 62 holding a discharge nozzle is moved by a spinning drive part 63 between a process position located above a substrate W and a stand-by position located at the outer side of a process cup enclosing the substrate W. When the nozzle arm 62 that has performed cleaning treatment of the substrate W is positioned in the stand-by position, the nozzle arm 62 is positioned in a groove 71a of a sponge 71 and contacts with the sponge 71. The contact enables the sponge 71 to absorb and remove droplets of a process liquid adhering to the nozzle arm 62. |
