| 摘要 |
<p>In order to provide a heat sink, which suppresses increase of cost and steps needed to manufacture an image display apparatus, and which can be more stably attached to a circuit board, the heat sink to be mounted on the circuit board is provided with an opening, and solder bonding regions that are provided on both the sides of the opening. The heat sink has such a shape that the opening is surrounded by the circuit board and by the heat sink when the solder bonding regions are bonded to the circuit board, and that a ventilation tunnel having one end portion and the other end portion opened is formed.</p> |
