| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer beveling part quality inspection method capable of quantitatively and non-destructively inspecting the quality of a wafer beveling part of beveled wafer.SOLUTION: A method for inspecting the quality of a wafer beveling part in a non-destructive manner includes an irradiation step for irradiating an X-ray beam 10 to a wafer beveling part 18 of beveled wafer, a measurement step for measuring an X-ray diffraction rocking curve of a diffraction X-ray diffracted inside the wafer beveling part 18, and a step for evaluating the quality of the wafer beveling part 18 on the basis of half value width of the measured X-ray rocking curve. |
