| 摘要 |
In this brazing method, which brazes an insulating substrate and a top plate that configure an HV inverter cooler, the insulating substrate is disposed on the top plate with a brazing material layer therebetween, and then, by means of laser irradiation, laser welding is performed at an arbitrary plurality of positions at the joining section between the top plate and the insulating substrate, thus provisionally affixing the insulating substrate to the top plate. Thereafter, by means of heating and melting the brazing material layer, the insulating substrate is brazed onto the top plate with the plurality of laser-welded positions as the brazing start points. After brazing, a power semiconductor is joined onto the insulating substrate corresponding to the center portion of the region surrounded by the plurality of brazing start points.
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