| 摘要 |
PROBLEM TO BE SOLVED: To provide a chuck table which accurately recognizes coordinates of an outer periphery even when droplets and bubbles exist as foreign objects at the outer periphery of a wafer, and to provide a wafer laser processing method that uses the chuck table.SOLUTION: A wafer is bonded to an annular frame through a substantially transparent adhesive tape and multiple devices are divided by division planning lines on its surface. A chuck table holds the wafer with a holding surface through the adhesive tape. The holding surface has a dark color region of a dark color. The dark color region is an annular region where its outer diameter is larger than a diameter of the wafer and its inner diameter is smaller than the diameter of the wafer. |
