发明名称 |
METHOD FOR MANUFACTURING WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To allow for easy insertion of a copper core material into a through hole and holding of the copper core material, to improve productivity of the wiring board, and also to reduce a manufacturing cost.SOLUTION: A method for manufacturing a wiring board comprises the steps of: inserting a core material 16 into a hole 20 formed on a substrate 2; mounting a resin 21 on at least one surface of the substrate; and filling the space between the holde and the core material with the resin by pressing down the resin. |
申请公布号 |
JP2013175779(A) |
申请公布日期 |
2013.09.05 |
申请号 |
JP20130099635 |
申请日期 |
2013.05.09 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
YANOKUCHI TAKAHIKO;MIYAGAWA AKIHISA;KOBAYASHI KAZUYASU |
分类号 |
H05K3/34;H05K1/02 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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