发明名称 METHOD FOR MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To allow for easy insertion of a copper core material into a through hole and holding of the copper core material, to improve productivity of the wiring board, and also to reduce a manufacturing cost.SOLUTION: A method for manufacturing a wiring board comprises the steps of: inserting a core material 16 into a hole 20 formed on a substrate 2; mounting a resin 21 on at least one surface of the substrate; and filling the space between the holde and the core material with the resin by pressing down the resin.
申请公布号 JP2013175779(A) 申请公布日期 2013.09.05
申请号 JP20130099635 申请日期 2013.05.09
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 YANOKUCHI TAKAHIKO;MIYAGAWA AKIHISA;KOBAYASHI KAZUYASU
分类号 H05K3/34;H05K1/02 主分类号 H05K3/34
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