LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE ARRAY USING THE SAME

摘要

PURPOSE: A light emitting diode package and a light emitting diode array using the same are provided to increase a package throughput by only replacing bad packages. CONSTITUTION: A pair of connection grooves is formed on the outer side of a substrate (110). A pair of connection projections protrudes from the outer side of the substrate. A light emitting diode (L) is arranged on the upper surface of the substrate. A power source applied to the light emitting diode is supplied to a pair of electrodes (120). The operation signal of the light emitting diode is applied to a pair of signal terminals.