TRANSPARENT LIGHT EMITTING DIODE PACKAGE AND THE FABRICATION METHOD THEROF

摘要

PURPOSE: A transparent light emitting device package and a manufacturing method thereof are provided to prevent a light absorption and a light loss due to a wire bonding metal line by mounting or depositing a light emitting device with a flip chip method. CONSTITUTION: A transparent substrate (310) includes at least one among a group which is composed of a coating or a mesh with conductive materials, a mixture of a glass fiber and an organic material, and carbon graphene. A light emitting device (320) is formed on one side of the transparent substrate and is bonded to or deposited on the transparent substrate with a flip chip method. A polarization layer (350) and a reflection layer (340) are formed on the other side of the transparent substrate.