| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board allowing for stable and accurate appearance quality check of the opening pattern of a via or stable and accurate check for the presence or absence of the occurrence of elution of copper (Cu) at a land exposed at an opening of a via which has strong correlation with the occurrence of defects in an opening pattern of such a via, and to provide a method of manufacturing the printed wiring board. SOLUTION: In the printed wiring board, at least one of copper wiring patterns 3 is connected to the land 5 exposed at the opening of the via 7 and to a lead section 9 for detecting elution of copper (Cu), provided in such a manner that the surface is exposed with an area smaller than the exposed area of the land 5 at a position differing from that of the land 5. An electroless tin (Sn) plated film is formed on the surface of the lead section 9 for detecting elution of copper (Cu). COPYRIGHT: (C)2011,JPO&INPIT |
