FILM FOR SEALING AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

The present invention provides a sealing film excellent in filling properties and adhesiveness as a sealing film which comprises a resin layer containing the following (A), (B) and (C) and having a flow within the range of 150 to 1800 µm at 80°C: (A) a resin component containing (a1) a high-molecular-weight component comprising crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of -50 to 50°C and (a2) a thermoplastic component comprising an epoxy resin as main component, (B) a filler having an average particle size within the range of 1 to 30 µm, and (C) a colorant, as well as a method for manufacturing the same and a semiconductor device using the same. The present invention also provides a sealing film excellent in adhesiveness and shape retention as a sealing film which comprises a resin layer containing the above (A), (B) and (C) and having a resin layer having a viscosity within the range of 10000 to 100000 Pa·s in a B-stage state at 50 to 100°C in thermosetting viscoelasticity measurement, as well as a semiconductor device using the same.