Cu-Mg-P based copper alloy material

摘要

A copper alloy material comprising, by mass%:
Mg of 0.3 to 2%;
P of 0.001 to 0.1%;
optionally, Zr of 0.001 to 0.03 %;
the balance including Cu and inevitable impurities,
wherein an area fraction of such crystal grains that an average misorientation between all pixels in each crystal grain is less tllan 4° is 45 to 55% of a measured area, when orientations of all the pixels in the area of the surface of the copper alloy material are measured in a step of 0.5 µm by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary,
and wherein a tensile strength is 641 to 708 N/mm 2 , and a bending elastic limit value is 472 to 503 N/mm 2 .