发明名称 COMPOSITE STRUCTURES HAVING IMPROVED HEAT AGING AND INTERLAYER BOND STRENGTH
摘要 Disclosed herein are overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, at least a portion of which is made of a surface resin composition, selected from polyamide compositions comprising a blend of two or more fully aliphatic polyamides having a melting point of at least 250° C., and comprising a fibrous material being impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, adhered to said first component over at least a portion of the surface of said first component, and wherein the matrix resin composition is selected from polyamide compositions comprising a one or more fully aliphatic polyamides having a melting point of at least 250° C.
申请公布号 EP2632718(A1) 申请公布日期 2013.09.04
申请号 EP20110785834 申请日期 2011.10.27
申请人 E.I. DU PONT DE NEMOURS AND COMPANY 发明人 ELIA, ANDRI, E.;KIRCHNER, OLAF, NORBERT;WAKEMAN, MARTYN DOUGLAS;YUAN, SHENGMEI
分类号 B32B5/26;B29C70/50;B29C70/68;B32B17/02;B32B17/10;B32B27/12;B32B27/34;C08J5/04;C08J5/10;C08J5/18;C08L77/00 主分类号 B32B5/26
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