发明名称 Method of manufacturing semiconductor device
摘要 A method of manufacturing a MOSFET includes the steps of preparing a substrate with an epitaxial growth layer made of silicon carbide, performing ion implantation into the substrate with the epitaxial growth layer, forming a protective film made of silicon dioxide on the substrate with the epitaxial growth layer into which the ion implantation was performed, and heating the substrate with the epitaxial growth layer on which the protective film was formed to a temperature range of 1600° C. or more in an atmosphere containing gas including an oxygen atom.
申请公布号 US8524585(B2) 申请公布日期 2013.09.03
申请号 US201213415406 申请日期 2012.03.08
申请人 MASUDA TAKEYOSHI;SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 MASUDA TAKEYOSHI
分类号 H01L21/265 主分类号 H01L21/265
代理机构 代理人
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