发明名称 |
Multilayer wiring board and method for manufacturing the same |
摘要 |
A wiring board has a substrate, a conductive pattern formed over the substrate, and an electronic component mounted to the substrate and having an electrode. The electrode of the electronic component is connected to the conductive pattern through a via hole. The thickness of the electrode of the electronic component is made less than the thickness of the conductive pattern.
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申请公布号 |
US8525041(B2) |
申请公布日期 |
2013.09.03 |
申请号 |
US20090543644 |
申请日期 |
2009.08.19 |
申请人 |
SHIMIZU KEISUKE;KAWAMURA YOICHIRO;IBIDEN CO., LTD. |
发明人 |
SHIMIZU KEISUKE;KAWAMURA YOICHIRO |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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