APPARATUS FOR PROCESSING SUBSTRATE AND METHOD FOR PROCESSING SUBSTRATE USING THE SAME

摘要

PURPOSE: An apparatus for processing a substrate and a method for processing the substrate using the same are provided to prevent damage to the substrate due to plasma by spraying plasma gas onto the substrate. CONSTITUTION: A substrate support part (120) is installed in a process chamber. The substrate support part supports at least one substrate. A chamber lid (115) covers the upper part of the process chamber. A gas injection part (130) is installed around the chamber lid. The gas injection part faces the substrate support part locally.