发明名称 |
Method and apparatus for cleaning a semiconductor substrate |
摘要 |
A method for cleaning a substrate is provided. The method initiates with disposing a fluid layer having solid components therein to a surface of the substrate. A shear force directed substantially parallel to the surface of the substrate and toward an outer edge of the substrate is then created. The shear force may result from a normal or tangential component of a force applied to a solid body in contact with the fluid layer in one embodiment. The surface of the substrate is rinsed to remove the fluid layer. A cleaning system and apparatus are also provided.
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申请公布号 |
US8522801(B2) |
申请公布日期 |
2013.09.03 |
申请号 |
US20060612371 |
申请日期 |
2006.12.18 |
申请人 |
FREER ERIK M.;DELARIOS JOHN M.;MIKHAYLICHENKO KATRINA;RAVKIN MICHAEL;KOROLIK MIKHAIL;REDEKER FRED C.;LAM RESEARCH CORPORATION |
发明人 |
FREER ERIK M.;DELARIOS JOHN M.;MIKHAYLICHENKO KATRINA;RAVKIN MICHAEL;KOROLIK MIKHAIL;REDEKER FRED C. |
分类号 |
B08B3/00 |
主分类号 |
B08B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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