| 发明名称 |
Fan for cooling multiple processors housed in a sub-chassis |
| 摘要 |
A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processors are cooled by a fan disposed on the sub-chassis.
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| 申请公布号 |
US8526177(B2) |
申请公布日期 |
2013.09.03 |
| 申请号 |
US20100773629 |
申请日期 |
2010.05.04 |
| 申请人 |
PAQUIN DAVID M.;NGUYEN JOHN D.;SABOTTA MICHAEL L.;WILSON LARRY E.;HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
PAQUIN DAVID M.;NGUYEN JOHN D.;SABOTTA MICHAEL L.;WILSON LARRY E. |
| 分类号 |
H05K7/20;H05K5/00 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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