发明名称 |
Method for manufacturing array substrate and array substrate, and method for manufacturing screen and screen |
摘要 |
A method for manufacturing an array substrate includes forming a plurality of holes in a film shape substrate having thermal plasticity, in which the holes have a diameter of 0.25 times to 2 times a thickness of the substrate, and a pitch of 5 times to 40 times the diameter of the holes; and heating a molding member provided with a plurality of convex portions or concave portions in an array pattern, pressing the substrate provided with the plurality of holes, and transferring the plurality of convex portions or concave portions to the substrate.
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申请公布号 |
US8526107(B2) |
申请公布日期 |
2013.09.03 |
申请号 |
US201213445047 |
申请日期 |
2012.04.12 |
申请人 |
SAITO ATSUSHI;AOKI KAZUO;YOSHITOME SHINTARO;SEIKO EPSON CORPORATION |
发明人 |
SAITO ATSUSHI;AOKI KAZUO;YOSHITOME SHINTARO |
分类号 |
G03B21/56 |
主分类号 |
G03B21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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