摘要 |
A component mounting method for mounting a component on a substrate is used by a component mounter including a mounting head mounting the component on the substrate, and an inspection head inspecting a surface status of the substrate. The component mounting method includes repeatedly mounting a component to be mounted on a predetermined substrate by the mounting head, determining whether or not the component to be mounted is a predetermined component, and when the determination is made that the component to be mounted is the predetermined component, performing at least one of inspecting a mounting status of the predetermined component after mounting the predetermined component and inspecting a status of a mounting surface on which the predetermined component is to be mounted, before mounting the predetermined component.
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