发明名称 Component mounting method, component mounting apparatus, method for determining mounting conditions, and apparatus and program for determining mounting conditions
摘要 A component mounting method for mounting a component on a substrate is used by a component mounter including a mounting head mounting the component on the substrate, and an inspection head inspecting a surface status of the substrate. The component mounting method includes repeatedly mounting a component to be mounted on a predetermined substrate by the mounting head, determining whether or not the component to be mounted is a predetermined component, and when the determination is made that the component to be mounted is the predetermined component, performing at least one of inspecting a mounting status of the predetermined component after mounting the predetermined component and inspecting a status of a mounting surface on which the predetermined component is to be mounted, before mounting the predetermined component.
申请公布号 US8527082(B2) 申请公布日期 2013.09.03
申请号 US20080600574 申请日期 2008.05.20
申请人 MAENISHI YASUHIRO;PANASONIC CORPORATION 发明人 MAENISHI YASUHIRO
分类号 G06F19/00;H01R43/00 主分类号 G06F19/00
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