发明名称 Adhesion promoting composition for metal leadframes
摘要 A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.
申请公布号 US8524540(B2) 申请公布日期 2013.09.03
申请号 US201113018668 申请日期 2011.02.01
申请人 KAPADIA NILESH 发明人 KAPADIA NILESH
分类号 H01L21/00;C23F1/00 主分类号 H01L21/00
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