发明名称 Brace for wire bond
摘要 An electrical connection includes a first wire having one end stitch bonded to a surface, such as the lead finger of a lead frame or the connection pad of a substrate. A second wire has a first end attached to the surface on a first side of the first wire and a second end attached to the surface on a second, opposing side of the first wire. The second wire acts as a brace that prevents the first wire from lifting off of the surface. If necessary, a third wire can be added that, like the second wire, acts as a brace to prevent the first wire from lifting off of the surface.
申请公布号 US8524529(B2) 申请公布日期 2013.09.03
申请号 US201113170208 申请日期 2011.06.28
申请人 HUANG MEIQUAN;LIU HEJIN;ZHANG HANMIN;FREESCALE SEMICONDUCTOR, INC. 发明人 HUANG MEIQUAN;LIU HEJIN;ZHANG HANMIN
分类号 H01L21/00 主分类号 H01L21/00
代理机构 代理人
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