发明名称 Circuit board and its wire bonding structure
摘要 The invention relates to a circuit board, and an image forming apparatus, a thermal head and an image sensor that employ the circuit board. A circuit board includes a substrate, a conductor which is situated on the substrate and has a groove formed on its surface, and a wire connected to the conductor. The groove surrounds a connection area between the wire and the conductor, excluding a part of the connection area defining an opening (X).
申请公布号 US8525040(B2) 申请公布日期 2013.09.03
申请号 US200913061097 申请日期 2009.08.31
申请人 AONO SHIGEO;KYOCERA CORPORATION 发明人 AONO SHIGEO
分类号 H05K1/09 主分类号 H05K1/09
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