发明名称 Bipolar punch-through semiconductor device and method for manufacturing such a semiconductor device
摘要 A bipolar diode is provided having a drift layer of a first conductivity type on a cathode side and an anode layer of a second conductivity type on an anode side. The anode layer includes a diffused anode contact layer and a double diffused anode buffer layer. The anode contact layer is arranged up to a depth of at most 5 mum, and the anode buffer layer is arranged up to a depth of 18 to 25 mum. The anode buffer layer has a doping concentration between 8.0*1015 and 2.0*1016 cm-3 in a depth of 5 mum and between 1.0*1014 up to 5.0*1014 cm-3 in a depth of 15 mum (Split C and D), resulting in good softness of the device and low leakage current. Split A and B show anode layer doping concentrations of known diodes, which have either over all depths lower doping concentrations resulting in high leakage current or enhanced doping concentration resulting in bad softness.
申请公布号 US8525302(B2) 申请公布日期 2013.09.03
申请号 US201213523184 申请日期 2012.06.14
申请人 MATTHIAS SVEN;ABB TECHNOLOGY AG 发明人 MATTHIAS SVEN
分类号 H01L21/02 主分类号 H01L21/02
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