发明名称 Semiconductor structure having a wetting layer
摘要 A semiconductor structure which includes a semiconductor substrate and a metal gate structure formed in a trench or via on the semiconductor substrate. The metal gate structure includes a gate dielectric; a wetting layer selected from the group consisting of cobalt and nickel on the gate dielectric lining the trench or via and having an oxygen content of no more than about 200 ppm (parts per million) oxygen; and an aluminum layer to fill the remainder of the trench or via. There is also disclosed a method of forming a semiconductor structure in which a wetting layer is formed from cobalt amidinate or nickel amidinate deposited by a chemical vapor deposition process.
申请公布号 US8525232(B2) 申请公布日期 2013.09.03
申请号 US201113206586 申请日期 2011.08.10
申请人 NOGAMI TAKESHI;WONG KEITH K. H.;YANG CHIH-CHAO;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 NOGAMI TAKESHI;WONG KEITH K. H.;YANG CHIH-CHAO
分类号 H01L29/78 主分类号 H01L29/78
代理机构 代理人
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