发明名称 |
Target-based thermal design using dummy insertion for semiconductor devices |
摘要 |
The present disclosure provides integrated circuit methods for target-based dummy insertion. A method includes providing an integrated circuit (IC) design layout, and providing a thermal model for simulating thermal effect on the IC design layout, the thermal model including optical simulation and silicon calibration. The method further includes providing a convolution of the thermal model and the IC design layout to generate a thermal image profile of the IC design layout, defining a thermal target for optimizing thermal uniformity across the thermal image profile, comparing the thermal target and the thermal image profile to determine a difference data, and performing thermal dummy insertion to the IC design layout based on the difference data to provide a target-based IC design layout. |
申请公布号 |
US8527918(B2) |
申请公布日期 |
2013.09.03 |
申请号 |
US201113227118 |
申请日期 |
2011.09.07 |
申请人 |
CHENG YING-CHOU;LUO BOREN;LIU WEN-HAO;OU TSONG-HUA;HSU CHIH-WEI;HUANG WEN-CHUN;LIU RU-GUN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHENG YING-CHOU;LUO BOREN;LIU WEN-HAO;OU TSONG-HUA;HSU CHIH-WEI;HUANG WEN-CHUN;LIU RU-GUN |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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