发明名称 Electronic assemblies and methods of forming electronic assemblies
摘要 An electronic assembly includes an electronic device having high-resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and an electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate.
申请公布号 US8523071(B2) 申请公布日期 2013.09.03
申请号 US201113082367 申请日期 2011.04.07
申请人 DEPAULA ANDREW;AAMODT LARRY;VYHMEISTER RONALD;INTELLIPAPER, LLC 发明人 DEPAULA ANDREW;AAMODT LARRY;VYHMEISTER RONALD
分类号 G06K7/00 主分类号 G06K7/00
代理机构 代理人
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