| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate structure, with a simple and cheap configuration, that inhibits detachment of a substrate from inside of a through hole.SOLUTION: A laminated substrate 1 has two outer layer substrates 3 laminated on top and bottom faces of one inner layer substrate 2. On the top and bottom faces of the inner layer substrate 2 are mounted circuit components not shown. On surfaces of the outer layer substrate 3 are mounted circuit components constituting an electric circuit not shown. The laminated substrate 1 comprises: through holes 5 electrically-connected through vertically-penetrating holes 4 to circuits between different layers; round-shaped lands 6 membrane-formed around the through holes 5 on the faces of the outer layer substrates 3; and reinforcing lands 7 that are formed on the top and bottom faces of the inner layer substrates 2 coaxially with the lands 6 centering the through holes 5, extend from the through holes 5 and are attached firmly to the outer layer substrates 3 laminated directly to the inner layer substrates 2. |
