| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device, a manufacturing method thereof, and a camera system which are capable of preventing, while suppressing occurrence of dusts, occurrence of cracks even in blade dicing and improving the cutting quality and the yield of dicing.SOLUTION: A solid-state imaging device includes a pixel part obtained by arranging a plurality of pixels performing photoelectric conversion, and a pixel signal readout part including a logic part and reading out a pixel signal from the pixel part. The pixel part and the logic part are formed as a layered structure. The layered structure includes a low hardness layer at least lower in hardness than other layers out of a plurality of layers. A dividing part different from other layers is formed in a side portion of the low hardness layer. |
