DICING-DIE BONDING TAPE AND MANUFACTURING METHOD OF SEMICONDUCTOR CHIP WITH ADHESIVE LAYER

摘要

PROBLEM TO BE SOLVED: To provide a dicing-die bonding tape which allows an adhesive layer to be accurately cut off so that pickup properties of a semiconductor chip with the adhesive layer can be improved.SOLUTION: A dicing-die bonding tape 1 comprises: an adhesive layer 3; a base material layer 4 laminated on one surface 3a of the adhesive layer 3; and a dicing layer 5 laminated on a surface 4b of the base material layer 4 on a side opposite to the adhesive layer 3 side. The breaking elongation of the base material layer 4 at 23°C exceeds 50%. The tensile load of the base material layer 4 at 23°C and at an elongation of 10% is 4 N or lower. The tensile load of a laminate of the base material layer 4 and the dicing layer 5 at 23°C and at an elongation of 10% is equal to or lower than 1.5 times the tensile load of the dicing layer 5 at 23°C and at an elongation of 10%.