| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting structure which enables only a weak heat resistant component to be selectively mounted without causing influences on peripheral electronic components when the weak heat resistant component such as a camera module is included in a structure where multiple electronic components such a portable module are mounted with high density, and to provide a manufacturing method of the electronic component mounting structure.SOLUTION: In an electronic component mounting structure 100, a joining material 106a and a weak heat resistant component 101 are mounted on an electrode 105a formed at a region located immediately above a mesh pattern region 104a, which has a low wiring rate, from among a power source and a GND pattern 104 which are formed on any wiring layer 103b of a wiring board 103. A coil 107 is brought close to a region where the weak heat resistant component is mounted to selectively heat only the mesh pattern by induction heating. Then, the weak heat resistant component and the electrode formed on the wiring board are joined through the joint material. |
