| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for suspension, a suspension, a suspension with a head, a hard disk drive, and a method for manufacturing a substrate for suspension, capable of reducing a differential impedance of interleave wiring.SOLUTION: On a base insulator layer 12 and wires 4A, 4B, 4C, 4D, a first cover insulator layer 14 covering the wires is formed, and then, on the first cover insulator layer, a second cover insulator layer 15 filling a space between the wires is formed. |
