MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device which improves joining strength between a substrate and a lid.SOLUTION: A manufacturing method of an electronic device according to this invention includes the steps of: preparing a lid 30 having a joining material 36 disposed on one surface and a substrate 110 on the surface of which having a recessed part 18 at a part thereof and an annular plating layer 4 is disposed through a base metal 2; mounting an electronic component 40 in a region that forms the inner side of the plating layer 4 in a plain view; disposing the lid 30 so that the electronic component 40 are housed together with the substrate 110 and the plating layer 4 overlaps with the joining material 36; and heating and melting the joining material 36 thereby joining the substrate 110 to the lid 30.