发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cutting device which can be accurately aligned by means of a bump.SOLUTION: A cutting device (1) for cutting a workpiece (W) comprising devices specified by a plurality of circular electrodes (B) and scheduled partition lines (S) for partitioning of the plurality of devices includes detection devices (8 and 9) which capture an image of the workpiece held by holding means (52) to detect a region to be cut. The detection devices include imaging means (8) for capturing an image of the workpiece, image storage means (91) for storing image information, center position calculation means (92) for calculating a center position of the image, and calculation means (93) for calculating positions of scheduled partition lines from the center position calculated by the center position calculation means.
申请公布号 JP2013171990(A) 申请公布日期 2013.09.02
申请号 JP20120035059 申请日期 2012.02.21
申请人 DISCO ABRASIVE SYST LTD 发明人 MIYATA SATOSHI
分类号 H01L21/301 主分类号 H01L21/301
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