| 摘要 |
PROBLEM TO BE SOLVED: To provide a heater which allows a tip end of a support member to project from the surface of a face plate by an appropriate amount without reducing the size of the support member and which allows thickness reduction of the face plate.SOLUTION: A heater comprises: a base plate; a face plate 3 which is located above the base plate, on which a wafer W is placed, and which is provided with a film heater 32 as heating means; a support pin 7 as a support member which protrudes upward from the face plate 3 to support the wafer W; and a holder which is fitted to a through-hole 300 formed on the face plate 3 to hold the support pin 7. |
