| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits increase in a physical size, and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises: a heater element (10); an electronic element (31) of a different member from the heater element (10); a substrate (30) for mounting the heater element (10) and the electronic element (31); a surrounding member (50) for surrounding the heater element (10); and a mold resin (70) for covering and protecting the electronic element (31), the substrate (30) and the surrounding member (50). A space between the heater element (10) and the surrounding member (50) is filled with a gas or a gel (90). |
