| 摘要 |
PROBLEM TO BE SOLVED: To prevent an optical device wafer from being damaged by correcting stress balance of the front and back sides of a wafer after laser processing to reduce warpage of the optical device wafer.SOLUTION: A method of dividing an optical device wafer (W) into individual chips along dividing schedule lines (301) formed on the surface thereof, includes: a divided starting point modified layer forming step for forming a divided starting point modified layer (304) on a front surface (W1) side in the optical device wafer (W); a corrected modified layer forming step for forming a corrected modified layer (306) on a back surface (W2) side in the optical device wafer (W) so as to adjust balance against internal stress by the divided starting point modified layer (304); and a grinding step for grinding the optical device wafer (W) from the back surface (W2) side to a finish thickness, and dividing the optical device wafer (W) by a grinding load during grinding work with the divided starting point modified layer (304) as a starting point. |
