CURABLE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition, which can be used for a substrate having inferior heat resistance and which has no solvent selectivity.SOLUTION: A curable resin composition includes: an acrylic polymer (A) prepared by polymerizing an acrylic ester (a) having a hydroxyl group as a structural component by 30% or more; and a basic compound (B) having a heterocyclic ring including nitrogen.