| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive for a SUS substrate, which comprises a curable epoxy resin composition that exhibits excellent adhesive strength to the SUS substrate and has preservation stability.SOLUTION: An adhesive for a SUS substrate contains a liquid curable epoxy resin composition containing the following component (A) and component (B). (A) is an epoxy resin or an epoxy-polyester hybrid resin, and (B) is an inclusion complex containing the following (b1) and (b2). (b1) is a carboxylic acid compound shown by formula: A(COOH), and (b2) is a compound shown by formula (II). |
