发明名称 RESIN COATING DEVICE AND RESIN COATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin coating device in which precipitation of phosphor is less likely to occur in a phosphor-containing resin applied to a substrate, and fraction defective of a final product thermally hardened by heating cure can be reduced, and to provide a resin coating method.SOLUTION: The resin coating device includes a substrate supply magazine 11 housing a substrate before being coated with a resin Q containing phosphor, a body 12 including a coating head 23 for coating a substrate 2 transferred from the substrate supply magazine 11 to a work position with the resin Q, and a heater 27 provided at a position facing the substrate supply magazine 11 while holding the body 12 therebetween, as a heating means for heating a substrate recovery magazine 13 in which the substrate 2 coated with the resin Q by means of the coating head 23 is housed, and the substrate 2 coated with the resin Q. For example, the heater 27 is provided in a path of the substrate 2 (below a substrate conveyor 22) before the substrate 2 coated with the resin Q is housed in the substrate recovery magazine 13.
申请公布号 JP2013172053(A) 申请公布日期 2013.09.02
申请号 JP20120035899 申请日期 2012.02.22
申请人 PANASONIC CORP 发明人 TSUNEMASA SATOSHI;ABE SHIGETAKA;NONOMURA MASARU
分类号 H05K3/00;H05K3/10 主分类号 H05K3/00
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