ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THEREOF

摘要

PURPOSE: An electronic component and a manufacturing method can control the occurrence of disconnection between a line-type conductor layer and a via hole conductor layer. CONSTITUTION: A laminate is formed by laminating an insulator layer (16). A coil conductor layer (18g) is installed on an insulator layer (16g). A coil conductor layer (18f) is installed on an insulator layer (16f) which is located at a point further in z-direction than the laminate. A via hole conductor (V6) connects one end of a coil conductor layer and a coil conductor layer, and penetrates an insulator layer in z-direction. As for the via hole conductor, a connecting surface (S1) which is connected to a coil conductor layer comprises a circle-form part (P1) and a protrusion part (P2). The protrusion part protrudes from the circle-form part to x-direction to which a coil conductor layer (18f) is extended from one end.