| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which makes it easy to reliably connect a plug conductive layer and a wiring layer in an upper layer of the plug conductive layer, and which can inhibit collapse of a distribution line.SOLUTION: A semiconductor device comprises: a plug conductive layer PL contacts a source/drain region SD formed on a principal surface of a semiconductor substrate SUB; a contact conductive layer CTC formed in contact with both of a top face and a lateral face of the plug conductive layer PL; and wiring layers BL, /BL, GND formed on the contact conductive layer CTC so as to be electrically connected with the contact conductive layer CTC. |
