| 摘要 |
PROBLEM TO BE SOLVED: To enable inhibition of warpage and deflection at an overhang part even when semiconductor chips are stacked in an overhang state.SOLUTION: A semiconductor chip in which a plurality of semiconductor chips are stacked on a wiring board such that a part of an upper semiconductor chip overhangs a lower semiconductor chip, comprises: a chip support film provided on the upper semiconductor chip on a surface on the side opposite to the wiring board side for warping the upper semiconductor chip to a direction opposite to the wiring board side. |
