| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting device capable of effectively transferring the heat generated from a semiconductor light-emitting element to a heat dissipation member, and a lighting fixture.SOLUTION: A light-emitting device comprises: a metal plate 2; a first insulating member 3; a second insulating member 4; a heat dissipation member 5; and an LED chip 8. The first insulating member 3 is bonded to a first surface 2a which is a top surface of the metal plate 2, and has an opening 3k exposing the first surface 2a of the metal plate 2. The LED chip 8 is arranged on a region exposed by the opening 3k on the first surface 2a of the metal plate 2. The second insulating member 4 is bonded to a second surface 2b which is a bottom surface of the metal plate 2, and has an opening 4k exposing the second surface 2b of the metal plate 2 to a region corresponding to a position where the LED chip 8 of the first surface 2a of the metal plate 2, is arranged. The heat dissipation member 5 is fastened to a region exposed by the opening 4k on the second surface 2b of the metal plate 2 through a conductive adhesive 9. |
