发明名称 SCRIBING DEVICE FOR SUBSTRATE OF BRITTLE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a scribing device capable of solving, in advance, problems arising from the occurrence of complete segmentation during processing in a scribing step.SOLUTION: A scribing device 1 includes at least either an upper cutter wheel 2 for processing a scribe line on a top surface of a brittle material substrate M to be processed, or a lower cutter wheel 3 for processing a scribe line on a bottom surface of the substrate M, and is provided with a displacement detecting mechanism 7 that, with a surface of the brittle material substrate M on which scribe lines S1 and S2 are formed as a substrate reference surface R1 or R2, detects the displacement when at least a portion of the substrate M is displaced towards the cutter wheel 2 side from the substrate reference surface.
申请公布号 JP2013170115(A) 申请公布日期 2013.09.02
申请号 JP20120036934 申请日期 2012.02.23
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TAKAMATSU IKUYOSHI;MIURA YOSHITAKA;TOMINAGA KEISUKE
分类号 C03B33/037;B28D5/00;C03B33/07 主分类号 C03B33/037
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