| 摘要 |
PURPOSE: A probe pin for probing a solder ball is provided to minimize the contamination of the probe pin of a probe card due to the solder ball and to enable a semiconductor inspection process without an additional contamination removing process. CONSTITUTION: A probe pin for probing a solder ball (70) comprises a cylindrical body with a hollow hole. When the solder ball is probed, the lower edge of the cylindrical body is contacted to the inclined surface of the solder ball. Foreign materials generated when the cylindrical body is contacted move along the inner and outer surfaces of the cylindrical body not to be deposited in the contacted portion of the lower edge of the cylindrical body. A discharge port, through which the foreign materials moving along the inner surface of the body are discharged, is formed in the body. |
