| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device and a semiconductor device manufacturing method which are capable of reducing the time required for manufacturing process and allow bonding with a tape substrate in a clean state.SOLUTION: The semiconductor manufacturing device includes: a tape supply unit 2 for supplying a tape substrate 8; a tape housing unit 3 for rewinding and housing the supplied tape substrate 8; a UV irradiation unit 6 which is provided between the tape supply unit 2 and the tape housing unit 3 and irradiates the tape substrate 8 with UV; a plasma irradiation unit 5 which is provided between the tape supply unit 2 and the tape housing unit 3 and irradiates the tape substrate 8 with plasma; and a bonding unit which is provided between the tape supply unit 2 and the tape housing unit 3 and bonds a semiconductor chip onto the tape substrate 8 having been irradiated with UV and irradiated with plasma. |
