| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces thermal resistance in a section from a semiconductor chip to a radiator and also restrains a variation in the thickness of an insulation layer caused by a metal block assembly error, thereby making it possible to improve heat radiation performance.SOLUTION: A semiconductor device comprises: a semiconductor chip 40 having an emitter electrode and a collector electrode respectively on both faces and a control electrode on at least one of the faces; an emitter plate 50 made of metal, which is joined to the emitter electrode of the semiconductor chip; a collector plate 60 made of metal, which is joined to the collector electrode of the semiconductor chip; a connection terminal connected to the control electrode via thin metal wire; and a mold resin 80 which seals the semiconductor chip, the emitter plate, the collector plate and part of the connection terminal, leaving an emitter conductive face 52 perpendicular to the bonded surface of the emitter plate with the semiconductor chip and a collector conductive face 62 perpendicular to the bonded surface of the collector plate with the semiconductor chip exposed. |
