发明名称 THERMOPLASTIC RESIN COMPOSITION AND MOLDING USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic resin which can suppress corrosion and discoloration of a metallic electrode, electric wire, or deposition film having a corrosive property by contact with or being proximate to free sulfur and which also has an excellent formability capable of forming various moldings such as an electric connector, a base material of a metal deposition film, a film, a sheet, and the like, even if a thermoplastic resin composition contains a compound including free sulfur, and to provide the molding using the thermoplastic resin.SOLUTION: A thermoplastic resin composition includes a thermoplastic resin (A), a compound (B) including free sulfur, and an inorganic compound (C) that is a carbonate or an oxide of a group-XI or XII element of the periodic law having no sulfur atom, and includes the inorganic compound (C) in a range of 0.05-15 pts.wt. with respect to 100 pts.wt. of the compound (B).
申请公布号 JP2013170195(A) 申请公布日期 2013.09.02
申请号 JP20120033921 申请日期 2012.02.20
申请人 DIC CORP 发明人 KAMIKADO NOBUAKI;KIMURA TOSHIKI
分类号 C08L67/00;C08K3/18;C08K3/30;C08L23/00;C08L69/00;C08L77/00;H01L51/50;H05B33/02;H05B33/26 主分类号 C08L67/00
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