发明名称 PRODUCTION METHOD OF BONDING WIRE
摘要 PROBLEM TO BE SOLVED: To provide a bonding wire which ensures a stabilized shape of small variation not protruding from an electrode during wire bonding.SOLUTION: The production method of a bonding wire includes a wire drawing step for passing a thin metallic wire 10 through a plurality of dies and drawing up to a predetermined wire size, and an annealing step for passing the thin metallic wire subjected to wire drawing through an anneal furnace 120 and annealing the thin metallic wire. In the annealing step, the thin metallic wire subjected to annealing is irradiated with atmospheric pressure plasma so as to clean the surface of the thin metallic wire.
申请公布号 JP2013172032(A) 申请公布日期 2013.09.02
申请号 JP20120035496 申请日期 2012.02.21
申请人 NIPPON MICROMETAL CORP 发明人 MURASE EIJI
分类号 H01L21/60 主分类号 H01L21/60
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